Innovative Solution Technology
SBM 2088A Semi-Automatic Solder Ball Mounter

IST – SBM 2088A is a Semi-automatic Solder Ball Mounter, designed using stencil flux printing and stencil ball placement methodology.

This novel ball mount tool is excellent for fast turn productions and small volume BGA R&D and engineering build. It is also recommended and was proven for SIP (System In Package) assembly and special / unusual ball mounting requirements with excellent results.

Your Ball Mounting Solution to ...

TAPE BGA

Strip and Singulated BGA

SIP (System In Package) and MCM packages

Features

  • Novel stencils fluxing and ball placement methodology
  • Quick and simple conversion
  • Nitrogen (N2) option for ball loading
  • FIFO (First in – first out) solder ball loading
  • Easy to operate … user friendly
  • Accuracy : +/- 0.05mm (0.3mm solder balls)

Contact us to review your application requirements

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General Specification

Substrates specification

Diameter: 0.30mm ~ 0.76mm
Pitch: 0.5mm and above
Substrate Thickness: 0.25mm ~ 3.00mm
Packages: BGAs (Singulated, Strips, Tape, Micro-BGA, etc …) SIP and MCM packages

Utilities

N2: Option
CDA: 5 Bar
Power Source: AC 230V 50 Hz

Tooling

Ball Dispensing Width: 25mm ~ 120mm
Ball Dispensing Length: 125mm ~250mm

Capability

Placement Accuracy: +/- 0.05mm